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Exhibiting the Linked Engineering and mAnufacturing Platform at ICT 2013

The ongoing EC co-funded LinkedDesign FP7 IP project presents its scope, objectives and intermediate results at the ICT 2013 event in Vilnius. Addressing the need for collaborative ICT in manufacturing design and product lifecycle management, the Linked Engineering and mAnufacturing Platform (LEAP) of LinkedDesign federates all product lifecycle information relevant to drive engineering and manufacturing processes, independent of its format, location, originator, and time of creation. Apart from the unified access to the integrated information, LEAP will provide specific knowledge exploitation solutions like sentiment analysis and design decision support systems to analyse the integrated information. Find us at the advanced research stand of LinkedDesign during 6th-8th November, 2013, at the Lithuanian Exhibition and Congress Centre LITEXPO, located in Zone R3 industry and business for tomorrow, Stand 4E5.